Solder joint reliability of lead-free solder balls assembled with SnPb solder paste

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 331-337

  Theuss, Horst ^a   Kilger, Thomas ^a   Ort, Thomas ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; INTEGRATED CIRCUITS; QUALITY CONTROL; RELIABILITY; SILICON WAFERS; SOLDERING ALLOYS;

SILICON CHIP; SOLDER BALLS; SOLDER JOINT RELIABILITY; STANDARD WAFERLEVEL PACKAGE;

ELECTRONICS PACKAGING;

EID: 0038350984     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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3. W. J. Choi, E.C.C. Yeh, K.N. Tu, P. Elenius and H. Balkan, "Electromigration of Flip Chip Solder Bump on Cu/Ni(V)/Al Thin Film Under Bump Metallization", Proc. 52th Electronic Components and Technology Conf, San Diego, CA, May, 2002, pp. 1201-1205
4. K.N. Tu and K. Zeng, "Reliability Issues of Pb-free Solder Joints in Electronic Packaging Technology", Proc. 52th Electronic Components and Technology Conf, San Diego, CA, May. 2002, pp. 1194-1200
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7. V. Patwardhan, N. Kelkar and L. Nguyen, "Lead-Free Wafer Level-Chip Scale Package: Assembly and Reliability, Proc. 52th Electronic Components and Technology Conf, San Diego, CA, May. 2002, pp. 1355-1358
8. D.-H. Kim, P. Elenius, M. Johnson and S. Barrett, M. Tanaka, "Solder Joint Reliability of a Polymer Reinforced Wafer Level Package", Proc. 52th Electronic Components and Technology Conf, San Diego, CA, May, 2002, pp. 1347-1354
9. Kulicke & Soffa Industries, Flip Chip Division, "SpheronTM WLP - A new WLP for improved Performance", www.kns.com/prodserv/FLIPCHIP/PDF/spheron.pdf
10. T. Snugovsky, T. Bagheri, M. Kelly and M. Romansky, "Solder Joint Formation with Sn-Ag-Cu and Sn-Pb Solder Balls and Pastes", SMTA International Proceedings 2002, Chicago, IL, September 2002