Characterization of fine pitch CSP solder joints under board-level free fall drop (BFFD)

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1053-1062

  Xie, Dongji ^a   Geiger, David ^a   Shangguan, Dongkai ^a   Rooney, Daniel T ^a   Gullo, Louis J ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; FINITE ELEMENT METHOD; PRINTED CIRCUIT BOARDS; PROBABILITY DISTRIBUTIONS; SOLDERED JOINTS;

BOARD-LEVEL FREE FALL DROP (BFFD); PLASTIC STRAIN; PRODUCT FREE FALL DROP (PFFD);

CHIP SCALE PACKAGES;

EID: 32844460849     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73484     Document Type: Conference Paper

References (5)

1. JESD-B104, Standard Method for Board Level Mechanical Shock Test of Components for Handheld Electronic Systems Application.
2. Dongji Xie, Minna Arra, Sammy Yi and Dan Rooney, Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices, ECTC 2003.
3. Flextronics Internal Document, Drop Test Specification for Camera Modules, 2005
4. Drop Test Standard Working Group, Interim Report of Drop Test Standard Development, by members including Amkor, Ericsson Mobile Platforms (EMP), Flextronics, Intel, Nokia Mobile Phones (NMP), Research in Motion (RM),Sony-Ericsson Mobile Communication, TI Wireless Packaging,W L Gore and etc., 2003.
5. Katsuro Hiraiwa and Masaharu Minamizawa, "Advanced LSI Packaging Technologies", http://magazine.fujitsu.com/us/vol36-1/paper14.pdf.