Forward and backward compatibility of solder alloys with component and board finishes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 2, 2007, Pages 138-146

  Kannabiran, Anand ^a,b   Pannerselvam, Elavarasan T ^a,c   Ramkumar, S Manian ^a  

^a ROCHESTER INSTITUTE OF TECHNOLOGY   (United States)

^b Vansco Electronics Inc   (United States)

^c Proworks Inc   (United States)

Author keywords

Compatibility; Lead free; Reliability; Shear test; Thermal aging; Thermal shock

Indexed keywords

AREA ARRAY COMPONENTS; BACKWARD COMPATIBILITIES; BALL GRID ARRAY SOLDER JOINTS; CHIP COMPONENTS; COMPATIBILITY; ELECTRONIC ASSEMBLIES; ELECTRONIC DEVICES; FATIGUE LIVES; HOT-AIR SOLDER LEVELING; ISOTHERMAL AGING; LEAD-FREE; MATRIXES; MICROSTRUCTURAL ANALYSIS; MIXED ASSEMBLIES; NUMBER OF CYCLES TO FAILURES; ORGANIC SOLDERABILITY PRESERVATIVES; PB-FREE; PB-FREE ALLOYS; PB-FREE ASSEMBLIES; PRIMARY OBJECTIVES; SHEAR ANALYSIS; SHEAR FORCES; SHEAR HEIGHTS; SHEAR TEST; SN-AG-CU; SN-PB ALLOYS; SN-PB SOLDERS; SOLDER ALLOYS; SOLDER JOINTS; SURFACE FINISHES; TEST VEHICLES; THERMAL SHOCK LOADINGS; THERMAL SHOCK TESTS; UNIFORM DISTRIBUTIONS;

AUTOMOBILE PARTS AND EQUIPMENT; BRAZING; DESIGN OF EXPERIMENTS; ELECTRONICS PACKAGING; INTERMETALLICS; LEAD; LEAD ALLOYS; RELIABILITY; RESISTORS; SAFETY ENGINEERING; SHOCK TESTING; SILVER; SOLDERING ALLOYS; STANDARDS; TESTING; THERMAL AGING; THERMAL SHOCK; TIN ALLOYS; WELDING;

TIN;

EID: 47249147864     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.899120     Document Type: Article

References (12)

1. J. Nguyen, D. Geiger, D. D. Rooney, and D. D. Shangguan, "Backward compatibility study of lead-free area array packages with tin-lead soldering process," in Proc. IPC SMEMA Council APEX Conf., 2006, pp. S34-03-1-S34-03-9.
2. P. Snugovsky, A. R. Zbrzezny, T. Lindsay, and R. Lau, "Reliability of mixed solder interconnects - Case studies," in Proc. SMTA Int. Conf. 2005.
3. J. L. Evans, C. Mitchell, M. Bozack, L. N. Payton, M. R. McQueeney, and J. R. Thompson, "Reliability of SAC BGA using Sn-Pb paste for harsh environment electronics," in Proc. SMTA Int. Conf., 2005.
4. P. Snugovsky, Z. Bagheri, M. Kelly, and M. Romansky, "Solder joint formation with Sn-Ag-Cu and An-Pb solder balls and pastes," in Proc. SMTA Int. Conf., 2002.
5. J. P. Clech, "Lead-free and mixed assembly solder joint reliability trends," in Proc. IPC SMEMA Apex 04, 2004.
6. G. Shi, M. Zhou, and H. Lu, "SAC and Sn-Pb solder joint thermal stress and strain characterization for resistor packages," in Proc. SMTA Int. Conf., 2004.
7. D. Nelson, H. Pallavicini, Q. Zhang, P. Friesen, and A. Dasgupta, "Manufacturing and reliability of Pb-free and mixed system assemblies (Sn-Pb/Pb-free) in avionics environments," J. Surf. Mount. Technol. vol. 17, no. 1, pp. 17-24, 2004.
8. JESD22-A103C, High Temperature Storage Life, JESD22-A103C. [Online]. Available: http://www.jedec.org
9. JESD22-A106B, Thermal Shock, JESD22-A106B [Online]. Available: http://www.jedec.org
10. Dusek, M. Nottay, and J. Hunt, "Compatibility of lead-free solders with PCB materials," Nat. Phys. Lab. Rep. MATC (a), Aug. 2001.
11. G. Shi, M. Zhou, and H. Lu, "SAC and Sn-Pb solder joint thermal stress and strain characterization for resistor packages," in Proc. SMTA Int. Conf., 2004.
12. A. A. Primavera, R. Sturm, S. Prasad, and K. Srihari, "Factors that affect void formation in BGA assembly," J. Surf. Mount Technol., pp. 19-26, Jan. 1999.