Mask and wafer cost of ownership (COO) from 65 to 22 nm half-pitch nodes

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7028, Issue , 2008, Pages

  Hughes, Greg ^a   Litt, Lloyd C ^a   Wüest, Andrea ^a   Palaiyanur, Shyam ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

(E ,3E) PROCESS; COST OF OWNERSHIP (COO); EXTREME ULTRA-VIOLET (EUV); MASK COSTS; MASK TECHNOLOGY; NEXT-GENERATION LITHOGRAPHY (NGL); OPTICAL MASKS; PHOTO MASKING; USE CASES;

COMPUTER NETWORKS; ELECTRON BEAM LITHOGRAPHY; FIBER OPTIC SENSORS; PIGMENTS; ULTRAVIOLET DEVICES;

TECHNOLOGY;

EID: 45549110244     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.793067     Document Type: Conference Paper

References (7)

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2. G. Shelden, P. Marmillion, and G. Hughes, "Mask Industry Assessment," Proc. of SPIE Vol. 6730, (BACUS 2007).
3. N. Toyama, Y. Inazuki, T. Sutou, T. Nagai, Y. Morikawa, H. Mohri, N. Hayashi, J. A. Huckabay, and Y. Abe, "Estimating DPL Photomask Fabrication Load Compared with Single Exposure," Proc. of SPIE Vol. 6607, 66072S (2007).
4. International Technology Roadmap for Semiconductors, Lithography, 2007 edition.
5. S. Yoshitake, H. Sunaoshi, K. Yasui, D. J. Resnick, G. M. Schmid, E. Thompson, O. Nagarekawa, H. Kobayashi, and T. Sato, "The Development of Full-Field High-Resolution Imprint Templates," Proc. of SPIE Vol. 6730, (BACUS 2007).
6. E. Muzio and P. Seidel, "Mask Cost of Ownership for Advanced Lithography," Proc. of SPIE Vol. 4066, 73 (2000).
7. A. Hazelton, A. Wüest, G. Hughes, and M. Lercel, "Mask Predicting Lithography Costs - Guidance for ≤ 32 nm Patterning Solutions," Proc. of SPIE Vol. 7928, 128, (BACUS 2008).