Estimating DPL photomask fabrication load compared with single exposure

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6730, Issue , 2007, Pages

  Toyama, Nobuhito ^a   Inazuki, Yuichi ^a   Sutou, Takanori ^a   Nagai, Takaharu ^a   Morikawa, Yasutaka ^a   Mohri, Hiroshi ^a   Hayashi, Naoya ^a   Huckabay, Judya A ^b   Abe, Yoshikuni ^b  

^a DAI NIPPON PRINTING CO LTD   (Japan)

^b CADENCE DESIGN SYSTEMS   (United States)

Author keywords

Decomposition; DFM; DPL DPT; EDA tool; Fracturing

Indexed keywords

AUTOMATIC DECOMPOSITION; IMAGE PLACEMENT;

INSPECTION; LITHOGRAPHY; PRINTED CIRCUITS; REPAIR; SEMICONDUCTOR DEVICE MANUFACTURE;

PHOTOMASKS;

FRACTURE; INSPECTION; LITHOGRAPHY; MASKING; SEMICONDUCTOR DEVICES;

EID: 42149186033     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.746982     Document Type: Conference Paper

References (7)

1. itrs2006update : public.itrs.net or etc.
2. F. M. Schellenberg; C. A. Mack, "MEEF in theory and practice", Proc. of SPIE Vol.3873 (1999)
3. T.Adachi, et al, "Extendibility of single mask exposure for practical ArF immersion lithography", Proc. of SPIE Vol.6607 (2007)
4. Appel, Kenneth & Haken, Wolfgang & Koch, John, Every Planar map is Four Colorable, Illinois: Journal of Mathematics: vol.21 (1977)
5. J.Huckabay, et al, "Automatic Pitch Decomposition for Improved Process Window when Printing Dense Features at kleff < 0.20", Proc of SPIE Vol.6283 (2006)
6. A. K. Wong "Resolution Enhancement Techniques in Optical Lithography" SPIE press (2001)
7. J.Park, et al, "Application Challenges with Double Patterning Technology (DPT) beyond 45nm", Proc of SPIE Vol. 6349 (2006)