Quantitative measurement of pattern collapse and particle removal force

ECS Transactions

Volumn 11, Issue 2, 2007, Pages 123-129

  Kim, T G ^a   Wostyn, K ^b   Mertens, P ^b   Busnaina, A A ^c   Park, J G ^a  

^a Hanyang University   (South Korea)

^b IMEC   (Belgium)

^c NORTHEASTERN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CLEANING; PHOTORESISTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; SILICA; SILICON NITRIDE;

CLEANING PROCESS; LINE PATTERN; PARTICLE REMOVAL; PATTERN COLLAPSE; PATTERN DAMAGES; QUANTITATIVE MEASUREMENT; SI SURFACES; SILICON OXYNITRIDES;

SILICON OXIDES;

EID: 45249095367     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.2779371     Document Type: Conference Paper

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