Analog design challenges and trade-offs using emerging materials and devices

ESSCIRC 2007 - Proceedings of the 33rd European Solid-State Circuits Conference

Volumn , Issue , 2007, Pages 123-126

  Fulde, M ^a,b   Mercha, A ^c   Gustin, C ^c   Parvais, B ^c   Subramanian, V ^c   Arnim, K V ^d   Bauer, F ^d   Schruefer, K ^d   Schmitt Landsiedel, D ^a   Knoblingert, G ^b  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

^c IMEC   (Belgium)

^d INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ARCHITECTURAL DESIGN; GEOMETRICAL OPTICS; MICROPROCESSOR CHIPS; PIGMENTS;

(P ,P ,T) MEASUREMENTS; ADVANCED MATERIALS; ANALOG DESIGNS; ANALOG DEVICES; EMERGING MATERIALS; EUROPEAN; FIGURES OF MERIT (FOM); FLICKER NOISES; MATCHING BEHAVIOR; MULTIPLE GATE; POWER CONSUMPTION (CE); SOLID-STATE CIRCUITS CONFERENCE;

ANALOG CIRCUITS;

EID: 44849110272     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSCIRC.2007.4430261     Document Type: Conference Paper

References (13)

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