Microthermogravimetry using a microcantilever hot plate with integrated temperature-compensated piezoresistive strain sensors

Review of Scientific Instruments

Volumn 79, Issue 5, 2008, Pages

  Lee, Jungchul ^a   King, William P ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURVE FITTING; SENSORS; THERMAL EFFECTS; THERMOGRAVIMETRIC ANALYSIS;

MICROCANTILEVER VIBRATION; MICROTHERMOGRAVIMETRY; PIEZORESISTIVE STRAIN SENSORS;

PARAFFINS;

EID: 44649150160     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2913337     Document Type: Article

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