Thermal characterization of embedded electronic features by an integrated system of CCD thermography and self-adaptive numerical modeling

Microelectronics Journal

Volumn 39, Issue 7, 2008, Pages 1008-1015

  Raad, Peter E ^a   Komarov, Pavel L ^a   Burzo, Mihai G ^a  

^a Southern Methodist University   (United States)

Author keywords

Adaptive simulation; Coupled experimental and numerical approach; Inverse heat transfer problem; Microelectronics; Temperature mapping; Thermoreflectance

Indexed keywords

HEAT TRANSFER; INVERSE PROBLEMS; TEMPERATURE MEASUREMENT;

ADAPTIVE SIMULATION; TEMPERATURE MAPPING; THERMOREFLECTANCE;

MICROELECTRONICS;

EID: 44649117930     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mejo.2007.11.006     Document Type: Article

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