A thermal benchmark chip: Design and applications

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 3, 1998, Pages 399-405

  Székely, Vladimir ^b   Márta, Csaba ^b   Rencz, Márta ^a,b   Végh, Gerzson ^b   Benedek, Zsolt ^b   Török, Sándor ^b  

^a IEEE

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Chip temperature gradient; Temperature sensor; Thermal benchmark; Thermal couplings; Thermal mapping; Thermal measurements; Thermal transients

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT LAYOUT; TEMPERATURE MEASUREMENT; THERMAL GRADIENTS;

TEMPERATURE SENSORS; THERMAL COUPLINGS; THERMAL MAPPING; THERMAL TRANSIENTS;

MICROPROCESSOR CHIPS;

EID: 0032157890     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.725202     Document Type: Article

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