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Volumn , Issue , 2002, Pages 368-371

A novel MEMS silicon probe card

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; BUILT-IN SELF TEST; ELECTRIC RESISTANCE MEASUREMENT; ELECTROPLATING; PROBES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SUBSTRATES;

EID: 0036122202     PISSN: 10846999     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEMSYS.2002.984279     Document Type: Article
Times cited : (20)

References (11)
  • 10
    • 0001081074 scopus 로고    scopus 로고
    • Ultra-low resistance, through-wafer via(TWV) technology and its application in three dimensional structures on silicon
    • April
    • (1999) Jpn. J. Appl. Phys. , vol.38 , pp. 2393-2396
    • Soh, H.T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.