Fabrication of a bump-type Si probe card

Digest of Papers - 2000 International Microprocesses and Nanotechnology Conference, MNC 2000

Volumn , Issue , 2000, Pages 76-77

  Lee, Dong Seok ^a   Park, Jeong Yong ^a   Kim, Dong Kwon ^a   Lee, Jong Hyun ^a  

^a Kyungpook National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; GEOMETRY; NANOTECHNOLOGY; SILICON WAFERS;

BURN-IN TEST; CONTACTING METALS; FABRICATION METHOD; GEOMETRICAL STRUCTURE; OPERATING FREQUENCY; PROBE CARDS; REDUCE COSTS; WAFER LEVEL;

PROBES;

EID: 84951975103     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMNC.2000.872630     Document Type: Conference Paper

References (3)

1. R. Dennis Bates, IEEE Int. Test Conf., (1997) 553
2. Yanwei Zhang et. al., IEEE J. Microelectromech. Syst., Vol. 8, (1999) 43
3. Koji Soejima et. al., IEEE Electronic components and Tech. Conf., (1999) 1175