Complex chemistry and the electroless copper plating process

Plating and Surface Finishing

Volumn 91, Issue 2, 2004, Pages 40-46

  Li, J ^a   Kohl, P A ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROCHEMICAL REDUCTION; ELECTROLESS COPPER PLATING; ETHYLENEDIAMINETETRAACETIC ACID; TRIETHANOLAMINE;

AMINES; COPPER; ELECTROCHEMISTRY; ELECTRODES; ELECTROLESS PLATING; FORMALDEHYDE; ORGANIC ACIDS; OXIDATION; PALLADIUM; PH EFFECTS; REDUCTION;

COPPER PLATING;

EID: 4444311661     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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