Choice of sensor for PC board through-hole deposit control in electroless copper plating

Plating and Surface Finishing

Volumn 84, Issue 10, 1997, Pages 49-52

  Bikulcius G ^a   Salkauskas M ^b   Pelanis, V ^c   Zukauskas K ^d  

^a UNIVERSITY OF NEW ORLEANS   (United States)

^b SOUTHERN REGIONAL RESEARCH CENTER   (United States)

^c CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

^d NONE

Author keywords

Co ordination; Computer modeling; Electrospray; Mass spectrometry; Oligosaccharides

Indexed keywords

COPPER; ELECTRIC RESISTANCE; ELECTROLYTES; IONS; METALLIZING; PH; PRINTED CIRCUIT BOARDS; SENSORS; SOLUTIONS; TEMPERATURE;

ELECTROLESS COPPER PLATING; HOLE METALLIZATION;

ELECTROLESS PLATING;

EID: 0031256215     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

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