A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 245-252

  Tay, A A O ^a   Ma, Y ^a   Nakamura, T ^b   Ong, S H ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b STONY BROOK UNIVERSITY   (United States)

^c National Semiconductor Manufacturing   (Singapore)

Author keywords

Delamination; Hygro thermal stress; Interfacial fracture mechanics; Moisture; Popcorn; Reliability

Indexed keywords

HYGRO-EXPANSION; HYGRO-THERMAL STRESS; INTERFACIAL FRACTURE MECHANICS; POPCORN;

DELAMINATION; INTEGRAL EQUATIONS; INTERFACES (MATERIALS); OSCILLATIONS; SOLDERING ALLOYS; STRAIN; THERMAL EFFECTS; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 4444291024     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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