A J-integral criterion for delamination of bi-material interfaces incorporating hygrothermal stress

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1421-1428

  Lin, T Y ^a   Tay, A A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0013292330     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (23)

1. Anderson, T.L., 1991 ,Fracture Mechanics, Fundamentals and Applications, by CAC Press . Inc.
2. Anjoh, I., Nishi, K., Kitano, M., and Yoshida, T. ,1988, " Analysis of the Package Cracking Problem with Vapor Phase Reflow Soldering and Corrective Action" Brazing soldering, pp.48-51
3. Akisanya, A,R. and Fleck, N,A., 1994, "The Edge Cracking and Decohesion of Thin Films" Int. J.Solids Structures. Vol. 31., No.23, pp3175-3199
4. Dasgupta, A. and Hu, J. M., 1992, "Fracture Mechanism Models for Brittle Fracture" IEEE Trans. Reliability, Vol. 41. no.3, p.328.
5. rd International Reliability Physics Symposium, pp 192-197.
6. th International Reliability Physics Symposium, pp. 90-95
7. Ganesan, G.S. and Berg, H.M., 1993 , "Model and Analysis for Solder Reflow Cracking Phenomenon in SMT Plastic Packages", IEEE Conf., pp 653-660.
8. Hibbitt, Karlsson & Sorensen, Inc., 1996. ABAQUS User's Manual, Version 5.5, USA.
9. Lin, R., Blackshear, E., and Serisky, P., 1988, "Moisture Induced Package Cracking in Plastic Encapsulated Surface Mount Components During Solder Reflow Process," Proc. Intl. Reliability Physics Symp., pp.83-89.
10. Liu, S., zhu, J., Hu, J.M., and Pao, Y,H., 1995, "Investigation of Crack Propagation in Ceramic/Conductive Epoxy/Glass System", IEEE Transactions on Components, Packaging, and Manufacturing Technology -PART A, Vol. 18. No.3
11. Liu, S. and Mei, Y.H. , 1995,"Behavior of Delaminated Plastic IC Package Subjected to Encapsulation Cooling , Moisture Absorption, and Wave Soldering" IEEE Transactions on Components, Packaging and Manufacturing Technology-PART A,Vol.18,No.3.
12. Malyshev, B. M. and Salganik, R.L., 1965, "The Strength of Adhesive Joints Using The Theory of Cracks," International Journal of Fracture Mechanics, Vol.1, No.2, pp. 114-128
13. Mcmaster, M.,G. and Soane, D. S., 1989, " Water Sorption in Epoxy Thin Films", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol.12,No.3
14. Nguyen, L,T, Chen, K., L., and .Schaefer, J., 1995, "A New Criterion for Package Integrity under Solder Reflow Conditions" IEEE,ECTC, pp.478-490.
15. Nishimura, A., Hirose, I., and Tanaka, N., 1992, "A New Method for Measuring Adhesion Strength of IC Molding Compounds" Journal of Electronic Packaging, Vol.114/407
16. Suzuki, S. and Oota, K., 1992, "Analysis of Solder Crack Phenomena in LSI Plastic Packages," ASME, Advances in Electronic Packaging, Vol.1, pp.343-347
17. Rice. J. R., 1968, "A Path Independent Integral and Approximate Analysis of Strain Concentration by Notch and Cracks." J. Appl. Mech. 35, 379-386.
18. Sauber, J., Lee, L., Hsu, S. ,and Hongsmatip, T., 1994, " Fracture Properties of Molding Compounds for IC Plastic Packaging" IEEE Transactions on Components, Packaging ,and Manufacturing Technology-PART A,Vol. 17. No.4
19. Shih, C., F., Moran, B., and Nakamura, T., 1986, "Energy Release Rate along a Three-Dimensional Crack Front in Thermally Stressed Body" International Journal of Fracture 30,pp. 79-102
20. Tanaka, N. and Nishimura, A., 1995, "Measurement of IC Molding Compound Adhesion Strength and Prediction of Interface Delamination within Package", EEP-Vol. 10-2, Advance in Electronic Packaging, ASME.
21. Tay, A. A. O, Tan, G., L., and Lim, T.,B., 1994, "Predicting Delamination in Plastic IC Packages and Determining Suitable Mold Compound Properties" IEEE Transactions on Components, Packaging, and Manufacturing Technology- Part B: Advanced Packaging, Vol. 17,No.2.
22. Tay, A. A. O. and Lin, T.,Y., 1996, "Moisture Diffusion and Heat Transfer in Plastic IC Packages" IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A. Vol. 19. No.2.
23. Wilson, W., K. and Yu, I., W., 1979, "The Use of the J-Integral in Thermal Stress Crack Problems", International Journal of Fracture, Vol. 15. No.4.