Measurement of interface toughness as a function of temperature, moisture concentration and mode mixity

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Tay, Andrew A O ^a   Yi Ma, Yi ^a   Huat Ong, Soon ^b   Nakamura, Toshio ^c  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b National Semiconductor   (Singapore)

^c STONY BROOK UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ENCAPSULATION; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); MOISTURE; RESIDUAL STRESSES; SURFACE ROUGHNESS; THERMOANALYSIS;

MODE MIXITY; PAD-ENCAPSULANT INTERFACES;

ELECTRONICS PACKAGING;

EID: 0342297923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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