Comparative study of copper electrodeposition from sulphate acidic electrolytes in the presence of IT-85 and of its components

Journal of Applied Electrochemistry

Volumn 35, Issue 1, 2005, Pages 69-76

  Varvara, S ^a   Muresan, L ^b   Popescu, I C ^b   Maurin, G ^c  

^a 1 DECEMBRIE 1918 UNIVERSITY OF ALBA IULIA   (Romania)

^b BABE BOLYAI UNIVERSITY   (Romania)

^c UMR 8235)   (France)

Author keywords

Additives; Copper electrodeposition; Electrochemical impedance spectroscopy; Kinetic parameters

Indexed keywords

ADDITIVES; CATHODES; ELECTRODEPOSITION; ELECTROLYTES; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; SPECTROSCOPY; SULFUR COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

CATHODIC PROCESSES; COPPER ELECTRODEPOSITION; KINETIC PARAMETERS; REACTION PATHWAYS;

COPPER;

EID: 11244306044     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1007/S10800-004-2398-1     Document Type: Article

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