Copper nucleation on titanium for thin film applications

Journal of Applied Electrochemistry

Volumn 29, Issue 10, 1999, Pages 1217-1227

  Dutra, A J B ^a   O'Keefe, T J ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; ELECTROCHEMISTRY; METAL FOIL; METALLIC FILMS; NUCLEATION; SCANNING ELECTRON MICROSCOPY; SOLUTIONS; SULFUR COMPOUNDS; TITANIUM;

AGITATION;

COPPER;

EID: 0032654038     PISSN: 0021891X     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1003537318303     Document Type: Article

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