Electrodeposition of copper on plasma and thermally oxidized titanium substrates

Surface and Coatings Technology

Volumn 89, Issue 3, 1997, Pages 225-232

  Zhang, Jian ^a   Teng, Kuo Shi ^a   O'Keefe, Thomas J ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Electrocrystallization; Nucleation; Overpotential; Polarization

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; CRYSTALLIZATION; METALLIC FILMS; NUCLEATION; PLASMA APPLICATIONS; POLARIZATION; SCANNING ELECTRON MICROSCOPY; SURFACE TREATMENT; THERMOOXIDATION; TITANIUM; X RAY DIFFRACTION ANALYSIS;

COPPER ELECTROCRYSTALLIZATION; COPPER NUCLEATION DENSITY; TITANIUM CATHODE BLANKS;

ELECTRODEPOSITION;

EID: 0031100870     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(96)02892-7     Document Type: Article

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