The self-formatting barrier characteristics of Cu-Mg/SiO2 and Cu-Ru/SiO2 films for Cu interconnects

Microelectronics Reliability

Volumn 48, Issue 5, 2008, Pages 744-748

  Yi, Seol Min ^a   Jang, Kwang Ho ^a   An, Jung Uk ^a   Hwang, Sang Soo ^a   Joo, Young Chang ^a  

^a Seoul National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DEBONDING; ELECTRIC BREAKDOWN; ELECTRIC CONDUCTIVITY; MAGNESIUM ALLOYS;

BARRIER CHARACTERISTICS; INTERFACIAL DEBONDING ENERGY; SANDWICHED STRUCTURE;

INTERCONNECTION NETWORKS;

EID: 43049176175     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.12.005     Document Type: Article

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