Direct microscale imprinting of Al at room temperature with Si inserts

Microsystem Technologies

Volumn 14, Issue 6, 2008, Pages 815-819

  Meng, W J ^a   Jiang, J ^a   Mei, Fanghua ^a   Sinclair, G B ^a   Park, Sunggook ^a  

^a Louisiana State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION MOLDING; FINITE ELEMENT METHOD; NANOSTRUCTURES; SILICON CARBIDE; TEMPERATURE DISTRIBUTION;

HARD MATERIALS; ROOM TEMPERATURE;

DIAMONDS;

EID: 43049144207     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-008-0567-6     Document Type: Article

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