Prediction of subsurface damage depth of ground brittle materials by surface profiling

International Journal of Machining and Machinability of Materials

Volumn 2, Issue 1, 2007, Pages 108-124

  Ohta, Tsutomu ^a   Yan, Jiwang ^b   Kuriyagawa, Tsunemoto ^b   Kodera, Sunao ^a   Nakasuji, Tomoaki ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

Author keywords

diamond turning; germanium; grinding; infrared lens; microcrack; silicon; subsurface damage; surface roughness

Indexed keywords

EID: 43049097473     PISSN: 17485711     EISSN: 1748572X     Source Type: Journal    
DOI: 10.1504/IJMMM.2007.012671     Document Type: Article

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