Preparation, microstructure, and properties of novel low-κ brominated epoxy/mesoporous silica composites

European Polymer Journal

Volumn 44, Issue 5, 2008, Pages 1414-1427

  Lin, Jingjing ^a   Wang, Xiaodong ^a  

^a BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY   (China)

Author keywords

BER mesoporous silica composites; Dielectric constant; Microstructure; Properties

Indexed keywords

COMPOSITE MATERIALS; EPOXY RESINS; PERMITTIVITY; SILICA; THERMODYNAMIC STABILITY; THERMOSETS;

3-METHYL-TETRAHYDROPHTHALIC ANHYDRIDE; BROMINATED EPOXY RESIN (BER) COMPOSITES; MESOPOROUS SILICA COMPOSITES;

MESOPOROUS MATERIALS;

EID: 42649110339     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2008.02.022     Document Type: Article

References (35)

1. Lee H., and Neville K. Handbook of epoxy resin (1967), McGraw-Hill Book Co., New York
2. Liaw D.J. Synthesis of polyphosphates by the polyaddition of bisphenol-S diglycidyl ether and aryl phosphorodichloridates. J Polym Sci, Part A: Polym Chem 35 12 (1997) 2365-2369
3. Wang X., and Lin J. A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties. Colloid Polym Sci 283 6 (2005) 593-603
4. Luo Y.L., Li Z.Q., and Lan W.X. Response behavior of an epoxy resin/amine curing agent/carbon black composite film to various solvents. Mater Sci Eng B 139 1 (2007) 105-113
5. Vouyovitch L., Alberola N.D., Flandin L., Beroual A., and Bessede J.L. Dielectric breakdown of epoxy-based composites: relative influence of physical and chemical aging. IEEE Trans Dielectr Electr Insulat 13 2 (2006) 282-292
6. Luda M.P., Balabanovich A.I., Zanetti M., and Guaratto D. Thermal decomposition of fire retardant brominated epoxy resins cured with different nitrogen containing hardeners. Polym Degrad Stab 92 6 (2007) 1088-1100
7. Krol P., Krol B., and Dziwinski E. Study on the synthesis of brominated epoxy resins. J Appl Polym Sci 90 11 (2003) 3122-3134
8. Weil E.D., and Levchik S. A review of current flame retardant systems for epoxy resins. J Fire Sci 22 1 (2004) 25-40
9. Yung K.C., Wu J., Yue T.M., and Xie C.S. Size effect of AlN on the performance of printed circuit board (PCB) material-brominated epoxy resin. J Compos Mater 40 7 (2006) 567-581
10. Yung K.C., Zhu B.L., Wu J., Yue T.M., and Xie C.S. Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate. J Polym Sci, Part B: Polym Phys 45 13 (2007) 1662-1674
11. Yung K.C., Wang J., and Yue T.M. Fabrication of epoxy-montmorillonite hybrid composites used for printed circuit boards via in-situ polymerization. Adv Compos Mater 15 4 (2006) 371-384
12. Chiu H.T., and Cheng M.F. Study of comparative tracking index on brominated epoxy and its application in copper clad laminates. J Appl Polym Sci 101 5 (2006) 2814-2818
13. Yang P.D., Zhao D.Y., Margolese D.I., Chmelka B.F., and Stucky G.D. Generalized syntheses of large-pore mesoporous metal oxides with semicrystalline frameworks. Nature 396 6707 (1998) 152-155
14. Zhao D.Y., Feng J.L., Huo Q.S., Melosh N., Fredrickson G.H., Chmelka B.F., et al. Triblock copolymer syntheses of mesoporous silica with periodic 50 to 300 angstrom pores. Science 279 5350 (1998) 548-552
15. Baskaran S., Liu J., Domansky K., Kohler N., Li X.H., Coyle C., et al. Low dielectric constant mesoporous silica films through molecularly templated synthesis. Adv Mater 12 4 (2000) 291-294
16. Yang C.M., Cho A.T., Pan F.M., Tsai T.G., and Chao K.J. Spin-on mesoporous silica films with ultralow dielectric constants, ordered pore structures, and hydrophobic surfaces. Adv Mater 13 14 (2001) 1099-1101
17. Zhao D.Y., Yang P., Melosh N., Feng J., Chmelka B.F., and Stucky G.D. Continuous mesoporous silica films with highly ordered large pore structures. Adv Mater 10 16 (1998) 1380-1383
18. Wang J., Zhang C.R., and Feng J. The development of low dielectric constant films. Prog Chem 17 6 (2005) 1001-1011
19. Schuth F., and Schmidt W. Microporous and mesoporous materials. Adv Eng Mater 4 5 (2002) 269-279
20. Morishige K., Tateishi N., and Fukuma S. Capillary condensation of nitrogen in MCM-48 and SBA-16. J Phys Chem B 107 22 (2003) 5177-5181
21. Shi Y.F., Meng Y., Chen D.H., Cheng S.J., Chen P., Yang T.F., et al. Highly ordered mesoporous silicon carbide ceramics with large surface areas and high stability. Adv Funct Mater 16 4 (2006) 561-567
22. Mascia L., Prezzi L., and Haworth B. Substantiating the role of phase bicontinuity and interfacial bonding in epoxy-silica nanocomposites. J Mater Sci 41 4 (2006) 1145-1155
23. Fan J., Yu C.Z., Wang L.M., Tu B., Zhao D.Y., Sakamoto Y., et al. Mesotunnels on the silica wall of ordered SBA-15 to generate three-dimensional large-pore mesoporous networks. J Am Chem Soc 123 48 (2001) 12113-12114
24. Yu C.Z., Fan J., Tian B.Z., and Zhao D.Y. Morphology development of mesoporous materials: a colloidal phase separation mechanism. Chem Mater 16 5 (2004) 889-898
25. Yamada T., Ueda T., and Kitayama T. Piezoelectricity of a high-content lead zirconate titanate/polymer composite. J Appl Phys 53 6 (1982) 4328-4332
26. 2 nanocomposite thin films by the sol-gel method. J Non-Cryst Solids 351 24-25 (2005) 2029-2035
27. Zhang Y.H., Lu S.G., Li Y.Q., Dang Z.M., Xin J.H., Fu S.Y., et al. Novel silica tube/polyimide composite films with variable low dielectric constant. Adv Mater 17 8 (2005) 1056-1059
28. Wahab M.A., Kim I., and Ha C.S. Microstructure and properties of polyimide/poly(vinylsilsesquioxane) hybrid composite films. Polymer 44 16 (2003) 4705-4713
29. Deligoz H., Yalcinyuva T., Ozgumus S., and Yildirim S. Electrical properties of conventional polyimide films: effects of chemical structure and water uptake. J Appl Polym Sci 100 1 (2006) 810-818
30. Liu H., Zhang W., and Zheng S. Montmorillonite intercalated by ammonium of octaaminopropyl polyhedral oligomeric silsesquioxane and its nanocomposites with epoxy resin. Polymer 46 1 (2005) 157-165
31. Bauer F., Decker U., Ernst H., Findeisen M., Langguth H., Mehnert R., et al. Functionalized inorganic/organic nanocomposites as new basic raw materials for adhesives and sealants. Part 2. Int J Adhes Adhes 26 7 (2006) 567-570
32. Wen J.Y., and Wilkes G.L. Organic/inorganic hybrid network materials by the sol-gel approach. Chem Mater 8 8 (1996) 1667-1681
33. Argon A.S., and Cohen R.E. Toughenability of polymers. Polymer 44 19 (2003) 6013-6032
34. Bartczak Z., Argon A.S., Cohen R.E., and Weinberg M. Toughness mechanism in semi-crystalline polymer blends: II. High-density polyethylene toughened with calcium carbonate filler particles. Polymer 40 9 (1999) 2347-2365
35. 3 particles. Polymer 43 13 (2002) 3661-3674