Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate

Journal of Polymer Science, Part B: Polymer Physics

Volumn 45, Issue 13, 2007, Pages 1662-1674

  Yung, K C ^a   Zhu, B L ^a,b   Wu, J ^b   Yue, T M ^a   Xie, C S ^c  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b WUHAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^c HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

AlN additives; Brominated epoxy; Coefficient of thermal expansion; Dielectric constant; Dielectric dissipation factor; Dynamic mechanical analysis; Glass transition temperature; Halogenated resins; Tensile strength; Theoretical models

Indexed keywords

ADDITIVES; ALUMINUM COMPOUNDS; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; GLASS TRANSITION; HALOGENATION; PERMITTIVITY; PRINTED CIRCUIT BOARDS; TENSILE STRENGTH; THERMAL EFFECTS; THERMAL EXPANSION;

ALN ADDITIVES; BROMINATED EPOXY; DIELECTRIC DISSIPATION FACTORS; HALOGENATED RESINS; THEORETICAL MODELS;

POLYMER MATRIX COMPOSITES;

EID: 34547324211     PISSN: 08876266     EISSN: None     Source Type: Journal    
DOI: 10.1002/polb.21201     Document Type: Article

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