Integration and electrical properties of carbon nanotube array for interconnect applications

2006 6th IEEE Conference on Nanotechnology, IEEE-NANO 2006

Volumn 1, Issue , 2006, Pages 262-265

  Choi, Young Moon ^a   Lee, Sunwoo ^a   Yoon, Hong Sik ^a   Lee, Moon Sook ^a   Kim, Hajin ^b   Han, Intaek ^b   Son, Yoonho ^a   Yeo, In Seok ^a   Chung, U In ^a   Moon, Joo Tae ^a  

^a SAMSUNG Electronics   (South Korea)

^b Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Carbon nanotube; Integration; Interconnect

Indexed keywords

ELECTRIC RESISTANCE; ELECTROCHEMICAL ELECTRODES; OPTICAL INTERCONNECTS; SILICON WAFERS; TITANIUM NITRIDE;

DIAMETERS; ELECTRODE PATTERNING; HOLE PATTERNING; PLANARIZATION;

CARBON NANOTUBES;

EID: 42549150646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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