A SEM and TEM study of the interconnect microstructure and reliability for a new XFLGA package

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 26-34

  Bennemann, S ^a   Graff, A ^a   Schischka, J ^a   Petzold, M ^a   Theuss, H ^b   Dangelmaier, J ^b   Pressel, K ^b  

^a FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; METALLIZING; MICROSTRUCTURE; OPTICAL INTERCONNECTS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

METALLIZATION INTERFACES; NANOMETER SCALES; STRESS TESTING;

ELECTRONICS PACKAGING;

EID: 42549150126     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.279974     Document Type: Conference Paper

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