A low cost leadless package concept

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 136-140

  Dangelmaier, J ^a   Theuss, H ^a   Paulus, S ^a   Pressel, K ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY;

HEIGHT REDUCTION; LEADLESS PACKAGES; PRESSURE COOKERS; RELIABILITY TEST; RF PERFORMANCE; SECOND LEVEL; SHORT CONTACTS; TEMPERATURE CYCLING;

ELECTRONICS PACKAGING;

EID: 84954069308     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271504     Document Type: Conference Paper

References (6)

1. th EMPC 2003, Friedrichshafen, Germany
2. nd Electronic Components and Technology Conference, ECTC 2003, San Diego, May 2002, pp. 365
3. nd Electronic Components and Technology Conference, ECTC 2003, San Diego, May 2002, pp. 359
4. nd Electronic Components and Technology Conference, ECTC 2003, San Diego, May 2002, pp. 657
5. th edition, "Advanced IC Packaging Markets and Trends", chapter 5.1.2
6. th International Symposium on Microelectronics, Boston U.S.A. Nov. 2003