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Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 272-279

A highly reliable flip chip solution based on electroplated AuSn bumps in a leadless package

(11) Theuss, H a Pressel, K a Paulus, S a Kilger, T a Dangelmaier, J a Lehner, R a Eisener, B a Kiendl, H a Schischka, J a Graff, A a Petzold, M a

a INFINEON TECHNOLOGIES AG (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GOLD ALLOYS; MOISTURE; OPTICAL INTERCONNECTS; PRODUCTION; QUALITY CONTROL; RELIABILITY;

AUTOCLAVE TESTS; BUMPS; LEADLESS PACKAGES; TEMPERATURE CYCLING;

FLIP CHIP DEVICES;

EID: 24644451679 PISSN: 05695503 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (13)

References (11)

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2
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3
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- A flip-chip mounted 29 GHz frequency divider in a novel small leadless plastic package
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- M. Engl, K. Pressel, J. Dangelmaier, H. Theuss, W. Eurskens, H. Knapp, W. Simbürger and R. Weigel, "A Flip-Chip Mounted 29 GHz Frequency Divider in a Novel Small Leadless Plastic Package", International Microwave Symposium, Fort Worth, June 2004
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4
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- A leadless packaging concept for high frequency applications
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- th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, June 2004, p. 1851
- (2004) th Electronic Components and Technology Conference, ECTC 2004 , pp. 1851
- Theuss, H.¹ Dangelmaier, J.² Engl, M.³ Pressel, K.⁴ Knapp, H.⁵ Simbürger, W.⁶ Gnannt, K.⁷ Eurskens, W.⁸ Hirtreiter, J.⁹ Weigel, R.¹⁰

5
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- First investigations of Au-Sn alloys on different end-metallizations
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- S. Anhöck, H. Oppermann, C. Kallmayer, R. Aschenbrenner, H. Reichl, L. Thomas, "First Investigations of Au-Sn Alloys on Different End-Metallizations", 3rd European Conference on Electronic Packaging Technology, EuPac 1998, Nuernberg, June 15-17, 1998
- (1998) 3rd European Conference on Electronic Packaging Technology, EuPac 1998
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6
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- Environmentally friendly semiconductor packages: The design of an Innovative leadless package concept
- Berlin, September ISBN 3-8167-6624-2
- T. Kilger, H. Theuss, S. Paulus, J. Dangelmaier, M. Dittes, and K. Pressel, "Environmentally Friendly Semiconductor Packages: The Design of an Innovative Leadless Package Concept", Electronic Goes Green, Berlin, September 2004, ISBN 3-8167-6624-2, p. 901
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- Kilger, T.¹ Theuss, H.² Paulus, S.³ Dangelmaier, J.⁴ Dittes, M.⁵ Pressel, K.⁶

7
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- Package characterization and development of a flip chip QFN package: FcMLF
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8
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9
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- Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
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- nd Electronic Components and Technology Conference, ECTC 2002, San Diego, May 2002, p. 282
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10
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- Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
- Las Vegas, June
- M. Hutter, F. Hohnke, H. Oppermann, M. Klein, G. Engelmann, "Assembly and Reliability of Flip Chip Solder Joints Using Miniaturized Au/Sn Bumps, 54th Electronic Components and Technology Conference, ECTC 2004, Las Vegas, June 2004, p. 49
- (2004) 54th Electronic Components and Technology Conference, ECTC 2004 , pp. 49
- Hutter, M.¹ Hohnke, F.² Oppermann, H.³ Klein, M.⁴ Engelmann, G.⁵

11
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- Ion beam polishing as final treatment for embedded cross-sections and its advantages for FESEM analysis in electronic packaging
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- W. Mack, B. Seidl, R. Fischer, T. Ort, J. Walter, J. Grünewald, L. Berthold, M. Petzold, "Ion Beam Polishing as Final Treatment for Embedded Cross-Sections and its Advantages for FESEM Analysis in Electronic Packaging", Proc. 30. Int. Sympos. on Testing and Failure Analysis (ISTFA) 2004, Worcester (MA), p. 338
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- Mack, W.¹ Seidl, B.² Fischer, R.³ Ort, T.⁴ Walter, J.⁵ Grünewald, J.⁶ Berthold, L.⁷ Petzold, M.⁸

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.