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Volumn 6, Issue 6, 2003, Pages 503-508

Interfacial Reaction and Joint Strength of Sn-Ag Base Solders on Electroless Ni-P/Au Plating

Author keywords

BGA; Bump Pull Test; Electroless Ni P Au Plating; Interfacial Reaction; Sn Ag Solder; Sn Ag Cu Solder

Indexed keywords


EID: 1542486338     PISSN: 13439677     EISSN: 1884121X     Source Type: Journal    
DOI: 10.5104/jiep.6.503     Document Type: Article
Times cited : (4)

References (3)
  • 2
    • 0032180855 scopus 로고    scopus 로고
    • An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance
    • P. T. Vianco: “An Overview of Surface Finishes and Their Role in Printed Circuit Board Solderability and Solder Joint Performance”, Circuit World, pp. 6-24, 1998.
    • (1998) Circuit World , pp. 6-24
    • Vianco, P.T.1
  • 3
    • 85024465593 scopus 로고
    • Omron Tech, p. 6, 1995.
    • (1995) Omron Tech , pp. 6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.