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Volumn 6, Issue 6, 2003, Pages 503-508
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Interfacial Reaction and Joint Strength of Sn-Ag Base Solders on Electroless Ni-P/Au Plating
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Author keywords
BGA; Bump Pull Test; Electroless Ni P Au Plating; Interfacial Reaction; Sn Ag Solder; Sn Ag Cu Solder
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Indexed keywords
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EID: 1542486338
PISSN: 13439677
EISSN: 1884121X
Source Type: Journal
DOI: 10.5104/jiep.6.503 Document Type: Article |
Times cited : (4)
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References (3)
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