Tensile properties of 100 nm thick Cu films

Cailiao Yanjiu Xuebao/Chinese Journal of Materials Research

Volumn 20, Issue 1, 2006, Pages 29-32

  Zhang, Bin ^a,b   Sun, Kaihong ^a,b   Gong, Jun ^b   Sun, Chao ^b   Cai, Qingkui ^a   Zhang, Guangping ^b  

^a NORTHEASTERN UNIVERSITY   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Fracture; Metallic materials; Polyimide; Ultra thin Cu film; Yield stress

Indexed keywords

COPPER; FRACTURE; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; TENSILE PROPERTIES; YIELD STRESS;

CU FILM; INTEGRATE CIRCUIT; POLYIMIDE SUBSTRATE;

THIN FILMS;

EID: 33646741652     PISSN: 10053093     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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