Fabrication of copper micro-tubes by electroless deposition with an etched porous aluminum template without using sensitization and activation

Materials Chemistry and Physics

Volumn 110, Issue 1, 2008, Pages 136-139

  Lu, Houfang ^a   Yan, Kangping ^a   Yan, Jixin ^b   Wang, Jianzhong ^b   Huang, Bin ^a  

^a SICHUAN UNIVERSITY   (China)

^b Jiangsu United Technology Group   (China)

Author keywords

Copper; Electroless deposition; Etching; Template

Indexed keywords

ALUMINUM COMPOUNDS; ALUMINUM FOIL; CATALYST ACTIVITY; ELECTROLESS PLATING; ETCHING; POROUS MATERIALS;

ALUMINUM MEMBRANES; COPPER MICROTUBES; POROUS ALUMINUM MEMBRANES; TEMPLATES;

COPPER COMPOUNDS;

EID: 41849102679     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2008.01.026     Document Type: Article

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