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Journal of Applied Physics

Volumn 103, Issue 6, 2008, Pages

Electromigration effects upon the Sn/Ni-7 wt % v interfacial reactions

(3) Chen, Chih Chi a Chen, Sinn Wen a Chang, Chih Horng a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTROMIGRATION; INTERFACES (MATERIALS); SURFACE DIFFUSION; SURFACE REACTIONS; TIN ALLOYS;

ELECTROMIGRATION EFFECTS; REACTION PHASES;

TERNARY ALLOYS;

EID: 41549149661 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.2899956 Document Type: Article

Times cited : (10)

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