Integration challenges of new materials and device architectures for IC applications

2004 International Conference on Integrated Circuit Design and Technology, ICICDT

Volumn , Issue , 2004, Pages 237-243

  Nguyen, Bich Yen ^a   Thean, Aaron ^a   White, Ted ^a   Vandooren, Anne ^a   Sadaka, Mariam ^a   Mathew, Leo ^a   Barr, Alexander ^a   Thomas, Shawn ^a   Zalava, Melissa ^a   Zhang, Da ^a   Eades, Debby ^a   Shi, Zhong Hai ^a   Schaeffer, Jamie ^a   Triyoso, Dina ^a   Samavedam, Sri ^a   Vartanian, Victor ^a   Stephen, Tab ^a   Goolsby, Brian ^a   Zollner, Stefan ^a   Liu, Ran ^a   Noble, Ross ^a   Nguyen, Thien ^a   Dhandapani, Veer ^a   Xie, Bruce ^a   Wang, Xang Dong ^a   Jiang, Jack ^a   Rai, Raghaw ^a   Sadd, Micheal ^a   Ramon, Micheal ^a   Kalpat, Sriram ^a   Prabhu, Lata ^a   Kaushik, Vidya ^a   Du, Yang ^a   Dao, Thuy ^a   Mendicino, Michael ^a   Orlowski, Marius ^a   Tobin, Phil ^a   Mogab, Joe ^a   Venkatesan, Suresh ^a   more..

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; DIFFUSION; ELECTRIC FIELDS; ELECTRIC POTENTIAL; EPITAXIAL GROWTH; LEAKAGE CURRENTS; MOSFET DEVICES; THIN FILM DEVICES; TRANSMISSION ELECTRON MICROSCOPY;

CAPACITOR EQUIVALENT THICKNESS (CET); EQUIVALENT OXIDE THICKNESS (EOT); SCANNING CAPACITANCE MICROSCOPY (SCM); SHORT CHANNEL EFFECTS (SCE);

CMOS INTEGRATED CIRCUITS;

EID: 4143148627     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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