Three-dimensional current density distribution simulations for a resistive patterned wafer

Journal of the Electrochemical Society

Volumn 151, Issue 9, 2004, Pages

  Purcar, M ^a   Van Den Bossche, B ^a   Bortels, L ^a   Deconinck, J ^a   Nelissen, G ^b  

^a VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

^b Elsyca NV   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; CATHODES; COMPUTER SIMULATION; COPPER COMPOUNDS; CURRENT DENSITY; DIFFUSION; ELECTRIC CONDUCTIVITY; FINITE ELEMENT METHOD; REACTION KINETICS; THREE DIMENSIONAL;

ELECTROCHEMICAL REACTORS; MULTI-ION TRANSPORT; RESISTIVE PATTERNED WAFER; THREE-DIMENSIONAL CURRENT DENSITY;

WSI CIRCUITS;

EID: 4944239908     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1772782     Document Type: Article

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