Current distribution for the metallization of resistive wafer substrates under controlled geometric variations

Journal of the Electrochemical Society

Volumn 153, Issue 4, 2006, Pages

  Lee, Jong Min ^a,c   McCrabb, Heather ^a,c   Jennings Taylor, E ^a   Carpio, Ron ^b,c  

^a FARADAY TECHNOLOGY INC   (United States)

^b SEMATECH   (United States)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GEOMETRIC VARIATIONS; HOLE SIZE; RESISTIVE WAFER SUBSTRATES; WAFER HOLDER;

CURRENT DENSITY; DEPOSITION; ELECTRIC CURRENT DISTRIBUTION; ELECTRIC INSULATION; NUMERICAL ANALYSIS; SUBSTRATES;

METALLIZING;

EID: 33644793632     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2171820     Document Type: Article

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