Hydrogen diffusion as the rate-limiting mechanism of stress development in dielectric films

Applied Physics Letters

Volumn 85, Issue 3, 2004, Pages 404-406

  Hughey, Michael P ^a   Cook, Robert F ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM THICKNESS; HYDROGEN DIFFUSION; STRESS DEVELOPMENT; STRESS MEASUREMENT;

ANNEALING; DIFFUSION; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HYDROGEN; HYDROGEN BONDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; REACTION KINETICS; TENSILE STRESS; THERMAL CONDUCTIVITY;

DIELECTRIC FILMS;

EID: 4043099681     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1773364     Document Type: Article

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