Reliability trends with advanced CMOS scaling and the implications for design

Proceedings of the Custom Integrated Circuits Conference

Volumn , Issue , 2007, Pages 405-412

  McPherson, J W ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST REDUCTION; ELECTROMIGRATION; LEAKAGE CURRENTS; SCALING LAWS;

FRONT-END-OF-LINE (FEOL); STRESS MIGRATION (SM);

CMOS INTEGRATED CIRCUITS;

EID: 39549104360     PISSN: 08865930     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2007.4405763     Document Type: Conference Paper

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