Implantable flexible wireless pressure sensor module

Proceedings of IEEE Sensors

Volumn 2, Issue , 2004, Pages 844-847

  Shin, Kyu Ho ^a   Moon, Chang Youl ^a   Lee, Tae Hee ^b   Lim, Chang Hyun ^b   Kim, Young Jun ^b  

^a Korea Advanced Nano Fab Center (KANC)   (South Korea)

^b Yonsei University   (South Korea)

Author keywords

Chip embedded flexible packaging; Implantable blood pressure sensor; Real time monitoring

Indexed keywords

BLOOD; BLOOD VESSELS; ETCHING; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; PRESSURE EFFECTS; REAL TIME SYSTEMS; SENSORS; SILICON; TELEMETERING;

CHIP EMBEDDED FLEXIBLE PACKAGING; IMPLANTABLE BLOOD PRESSURE SENSORS; REAL-TIME MONITORING; THINNED SILICON CHIPS;

CHIP SCALE PACKAGES;

EID: 27944484926     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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