Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging

Microelectronics Reliability

Volumn 48, Issue 3, 2008, Pages 425-430

  Wan, J W ^a   Zhang, W J ^b   Bergstrom, D J ^b  

^a GUANGZHOU UNIVERSITY   (China)

^b UNIVERSITY OF SASKATCHEWAN   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY FLOW; MATHEMATICAL MODELS; NON NEWTONIAN FLOW; RELIABILITY THEORY; VERIFICATION;

CAPILLARY FORCES; FLIP CHIP PACKAGING; WASHBURN MODELS;

FLIP CHIP DEVICES;

EID: 39449100879     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.06.006     Document Type: Article

References (11)

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