Wide-band low-loss MEMS packaging technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 2005, Issue , 2005, Pages 765-768

  Muldavin, Jeremy ^a   Bozler, Carl ^a   Rabe, Steve ^a   Keast, Craig ^a  

^a MIT LINCOLN LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND AMPLIFIERS; CMOS INTEGRATED CIRCUITS; COATING TECHNIQUES; GOLD COMPOUNDS; METALS; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING;

CMOS COMPATIBLE FRONT END PROCESSING; HERMETIC THRU WAFERS; MEMS PACKAGING; THERMO COMPRESSION BONDING;

ELECTRONICS PACKAGING;

EID: 33749244984     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2005.1516724     Document Type: Conference Paper

References (8)

1. S. Duffy, C. Bozler, S. Rabe, J. Knecht, L. Travis, P. Wyatt, C. Keast, and M. Gouker, "MEMS microswitches for reconfigurable microwave circuitry," Microwave and Wireless Components Letters, vol. 11, no. 3, pp. 106-108, Mar. 2001.
2. C.L. Goldsmith, Z. Yao, S. Eshelman, and D. Denniston, "Performance of low-loss RF MEMS capacitive switches," IEEE Microwave Guided Wave Lett., vol. 8, pp. 269-271, August 1998.
3. S. Majumder, J. Lampen, R. Morrison, and J. Maciel, "A packaged, high-lifetime ohmic MEMS RF switch," in 2005 IEEE MTT-S Int. Microwave Symp. Dig., June 2003, vol. 3, pp. 1935-1938.
4. J. B. Muldavin, C. Bozler, S. Rabe, and C. Keast, "Large tuning range analog and multi-bit MEMS varactors," in 2004 IEEE MTT-S Int. Microwave Symp. Dig., Pheonix, AZ, June 2004.
5. D. Peroulis and L.P.B. Katehi, "Electrostatically-tunable analog RF MEMS varactors with measured capacitance range of 300%," in IEEE MTT-S Int. Microwave Symp. Dig., Philadelphia, PA, June 2003, pp. 1793-1796.
6. Y-K Park, Y-K Kim, C-J Kim, B-K Ju, and J-O Park, "Innovation ultra thin packaging for RF-MEMS devices," in 12th International Conference on Transducers, Solid-State Sensors, Actuators and Microsystems, June 2003. pp. 903-906.
7. A. Margomenos and L.P.B. Katehi, "Fabrication and accelerated hermeticity testing of an on-wafer package for RF MEMS," IEEE Trans. on Microwave Theory and Techniques, vol. 52, no. 6, pp. 1626-1636, June 2004.
8. E. Yamashita, K. Atsuki, and T. Hirahata, "Microstrip dispersion in a wide frequency range," IEEE Transactions on Microwave Theory and Techniques, vol. 29, pp. 610-611, June 1981.