Comparative study on solder joint reliability using different FE-models

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 687-694

  Zhu, W H ^a   Stoeckl, S ^b   Pape, H ^b   Gan, S L ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; INTERMETALLICS; RELIABILITY ANALYSIS; SOLDERED JOINTS; SOLDERING ALLOYS;

BALL GRID ARRAY PACKAGES; COMPARATIVE STUDIES; FAILURE LOCATIONS; GOOD CORRELATIONS; RESIST MATERIALS; SOLDER JOINT RELIABILITY; TEMPERATURE CYCLING; VISCOPLASTIC MATERIALS;

FINITE ELEMENT METHOD;

EID: 84954062104     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271607     Document Type: Conference Paper

References (11)

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