메뉴 건너뛰기




Volumn 25, Issue 1, 1999, Pages 25-29

Reliability comparison of different surface finishes on copper

Author keywords

Coatings; Copper; Printed circuit boards; Surface finishing

Indexed keywords

COATING TECHNIQUES; COATINGS; COPPER; COSTS; RELIABILITY; SURFACE PROPERTIES;

EID: 0032181830     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129910244798     Document Type: Article
Times cited : (9)

References (15)
  • 2
    • 0028422134 scopus 로고
    • Comparison of electrolytic and electroless Ni/Au finishing process for multi-layer ceramic IC packages
    • April
    • Winers, E.D., Baxter, W.K. and Choudhury, A., "Comparison of electrolytic and electroless Ni/Au finishing process for multi-layer ceramic IC packages", Plating and Surface Finishing, April, 1994, pp. 72-7.
    • (1994) Plating and Surface Finishing , pp. 72-77
    • Winers, E.D.1    Baxter, W.K.2    Choudhury, A.3
  • 3
    • 0039187695 scopus 로고    scopus 로고
    • The development and use of a modified immersion tin as a high performance solderable finish
    • Ormerod, D., "The development and use of a modified immersion tin as a high performance solderable finish", Proceedings, NEPCON West. 1998, pp. 1515-26.
    • (1998) Proceedings, NEPCON West , pp. 1515-1526
    • Ormerod, D.1
  • 6
    • 46149152765 scopus 로고    scopus 로고
    • OSPs: Application process guidelines for optimal assembly performance
    • Farrell, R., "OSPs: application process guidelines for optimal assembly performance". IPC Printed Circuits Expo. 1998, pp. S11-5-1-S11-5-8.
    • (1998) IPC Printed Circuits Expo.
    • Farrell, R.1
  • 9
    • 0242264116 scopus 로고
    • Mechanical defelection system - An innovative test method for SMT assemblies
    • Lahaina, Hawaii, 26-30 March
    • Zubelewicz, A., Tokarz, R.F., Kuracina, R.P. and McGinniss, J.L., "Mechanical defelection system - an innovative test method for SMT assemblies", Proceedings, INTERpack '95, Lahaina, Hawaii, 26-30 March, Vol. 2, 1995, pp. 1167-78.
    • (1995) Proceedings, INTERpack '95 , vol.2 , pp. 1167-1178
    • Zubelewicz, A.1    Tokarz, R.F.2    Kuracina, R.P.3    McGinniss, J.L.4
  • 11
    • 0030401561 scopus 로고    scopus 로고
    • The influence of pad geometry on ceramic ball grid array solder joint reliability
    • Austin, TX
    • Yee, S. and Ladhar, H., "The influence of pad geometry on ceramic ball grid array solder joint reliability", Proceedings, 1996 IEMT Symposium, Austin, TX, pp. 267-73
    • Proceedings, 1996 IEMT Symposium , pp. 267-273
    • Yee, S.1    Ladhar, H.2
  • 12
    • 85033973058 scopus 로고    scopus 로고
    • note
    • Private communications with Dr Aleksander Zubelewicsz on CCGA failure mechanism during MDS test and unpublished Solectron internal document on reliability study in CCGA process development, 1998.
  • 13
    • 0001224551 scopus 로고
    • Reactive wetting and intermetallic formation
    • Yost, F.G., Hosking, F.M. and Frear, D.R. et al. (Ed), Chapter 4. Van Nostrand Reinhold, New York, NY
    • Boettinger, W.J., Hand-Werker, C.A. and Kattner, U.R., "Reactive wetting and intermetallic formation", in Yost, F.G., Hosking, F.M. and Frear, D.R. et al. (Ed), The Mechanics of Solder Alloy Wetting and Spreading, Chapter 4. Van Nostrand Reinhold, New York, NY, 1993 pp. 103-40.
    • (1993) The Mechanics of Solder Alloy Wetting and Spreading , pp. 103-140
    • Boettinger, W.J.1    Hand-Werker, C.A.2    Kattner, U.R.3
  • 14
    • 0005436048 scopus 로고
    • Interfaces and intermetallics
    • Frear, D., Morgan, H., Burchett, S. and Lau, J. (Eds), Van Nostrand Reinhold. New York, NY
    • Marshall, J.L., Foster, L.A. and Sees, J.A., "Interfaces and intermetallics", in Frear, D., Morgan, H., Burchett, S. and Lau, J. (Eds), The Mechanics of Solder Alloy Interconnects. Van Nostrand Reinhold. New York, NY, 1994, pp. 42-86.
    • (1994) The Mechanics of Solder Alloy Interconnects , pp. 42-86
    • Marshall, J.L.1    Foster, L.A.2    Sees, J.A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.