Nanostructuring of polymers by hot embossing lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5374, Issue PART 1, 2004, Pages 203-208

  Scheer, H C ^a   Glinsner, T ^b   Wissen, M ^a   Pelzer, R ^b  

^a UNIVERSITY OF WUPPERTAL   (Germany)

^b EV GROUP   (Austria)

Author keywords

De embossing; Hot embossing lithography; Large area imprinting; Nanoimprinting

Indexed keywords

COOLING; HEATING; LITHOGRAPHY; NANOSTRUCTURED MATERIALS; SAMPLING; SEPARATION;

DE-EMBOSSING; HOT EMBOSSING LITHOGRAPHY; LARGE AREA IMPRINTING; NANOIMPRINTING;

POLYMERS;

EID: 3843095973     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.535741     Document Type: Conference Paper

References (8)

1. N.Roos, T.Xuxbacher, T.Glinsner, K.Pfeiffer, H.Schulz, H.C. Scheer, "Nanoimprint Lithography with a Commercial 4 Inch Bond System for Hot Embossing", Proc. SPIE 4343, (2001), 427-435
2. S.C. Jakeway, H.J. Crabtree, T. Veres, N.S. Cameron, H. Luesebrink, T. Glinsner, "Transition of MEMS Technoloy to Nanofabrication", Proceedings of the International Conference on MEMS, NANO and Smart Systems (ICMENS03), July 20-23, 2003, Banff, Alberta, Canada.
3. B. Michel, A. Bernard, A. Bietsch, E. Delamarche, M. Geissler, D. Juncker, H. Kind, J.-P. Renault, H. Rothuizen, H. Schmid, P. Schmidt-Winkel, R. Stutz, H. Wolf, "Printing meets lithography: Soft approaches to high-resolution patterning", IBM J. RES. & Dev. 45, (2001), 697-719
4. R. Islam, B. Wieder, P. Lindner, T. Glinsner, C. Schaefer, "Micron precision optically aligned method for hotembossing and nanoimprinting", Sensors, 2002. Proceedings of IEEE 2, (2002), 931-935.
5. N. Roos, T. Glinsner, H.-C. Scheer, "Impact of vacuum environment on the hot embossing process", Proc. SPIE 5037, (2003), 211-218
6. L. Bendfeldt, H. Schulz, N. Roos, H.-C. Scheer, "Groove design of vacuum chucks for hot embossing lithography", Microelectronic Engineering 61-62, (2002), 455-459
7. N. Roos, H. Schulz, M. Fink, K. Pfeiffer, F. Osenberg, H.-C. Scheer, "Performance of 4" wafer-scale thermoset working stamps in hot embossing lithography", Proc. SPIE 4688, (2002), 232-239
8. M. Wissen, H. Schulz, N. Bogdanski, H.-C. Scheer, Y. Hirai, H. Kikuta, G. Ahrens, K. Pfeiffer, "UV curing of resists for warm embossing", to be published in Microelectronic Engineering 2004