SCOPUS 정보 검색 플랫폼

Volumn 5037 I, Issue , 2003, Pages 211-218

Impact of vacuum environment on the hot embossing process

b EVGroup ^* (Austria)

Author keywords

Hot embossing lithography; Vacuum embossing; Wafer scale imprint

Indexed keywords

COMPRESSED AIR; DECOMPOSITION; MOLECULAR WEIGHT; PROCESS ENGINEERING; SEMICONDUCTOR DEVICE MANUFACTURE; VACUUM APPLICATIONS;

HOT EMBOSSING PROCESS; VACUUM EMBOSSING; WAFER SCALE IMPRINT;

LITHOGRAPHY;

EID: 0141613076 PISSN: 0277786X EISSN: None Source Type: Conference Proceeding
DOI: 10.1117/12.482750 Document Type: Conference Paper

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.