Inorganic Bi/In thermal resist as a high etch ratio patterning layer for CF4/CHF3/O2 plasma etch

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5376, Issue PART 2, 2004, Pages 867-878

  Tu, Yuqiang ^a   Chapman, Glenn ^a   Peng, Jun ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

Author keywords

Anisotropic etch; Etch mask; Inorganic photoresist; Plasma etch; Thermal resist

Indexed keywords

ANISOTROPY; BIMETALS; BISMUTH; INDIUM; LASER APPLICATIONS; MASKS; OXIDATION; PLASMA ETCHING; SOLUTIONS; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

ANISOTROPIC ETCH; ETCH MASKS; INORGANIC PHOTORESISTS; THERMAL RESISTS;

PHOTORESISTS;

EID: 3843077407     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.536193     Document Type: Conference Paper

References (16)

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2. Y. Tu, G. Chapman, M. Sarunic, "Bimetallic Thermal Activated Films for Microfabrication, Photomasks and Data Storage", Proceedings of SPIE Vol. 4637, pp. 330-340, 2002.
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