ETS-A: A new electrothermal simulator for CMOS VLSI circuits

Proceedings of European Design and Test Conference

Volumn , Issue , 1996, Pages 566-570

  Cheng, Yi Kan ^a   Rosenbaum, Elyse ^a   Kang, Sung Mo ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; CMOS INTEGRATED CIRCUITS; CONVERGENCE OF NUMERICAL METHODS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; MATHEMATICAL TRANSFORMATIONS; TEMPERATURE MEASUREMENT;

CHIP TEMPERATURE PROFILE; ELECTROTHERMAL SIMULATOR;

VLSI CIRCUITS;

EID: 0029755985     PISSN: 10661409     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)