SISSSI - a tool for dynamic electro-thermal simulation of analog VLSI cells

Proceedings of European Design and Test Conference

Volumn , Issue , 1997, Pages 617-

  Szekely, V ^a   Pahi, A ^a   Poppe, A ^a   Rencz, M ^a   Csendes, A ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; THERMAL EFFECTS;

SISSSI ELECTROTHERMAL SIMULATOR;

VLSI CIRCUITS;

EID: 0030718130     PISSN: 10661409     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)