THERMAN: A thermal simulation tool for IC chips, microstructures and PW boards

Microelectronics Reliability

Volumn 40, Issue 3, 2000, Pages 517-524

  Székely, Vladimír ^a   Poppe, András ^b   Rencz, Márta ^b   Rosental, Miklós ^a   Teszéri, Tamás ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

^b MicReD Ltd   (Hungary)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; THERMAL EFFECTS; UNIX; USER INTERFACES;

SOFTWARE PACKAGE THERMAN; THERMAL SIMULATION TOOLS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0342656550     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0026-2714(99)00249-8     Document Type: Article

References (18)

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