Optimization of control parameters in micro hot embossing

Microsystem Technologies

Volumn 14, Issue 3, 2008, Pages 325-329

  He, Yong ^a   Fu, Jian Zhong ^a   Chen, Zi Chen ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; OPTIMIZATION; PARAMETER ESTIMATION; PATTERN RECOGNITION; PRESSURE DISTRIBUTION;

CONTROL PARAMETERS; HYDRAULIC PRESSURE SYSTEM; MICRO HOT EMBOSSING;

CONTROL SYSTEMS;

EID: 38349160167     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0497-8     Document Type: Article

References (8)

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3. Juang YJ, Lee JL, Kurt WK (2002) Hot embossing in microfabrication, part II Rheological characterization and process analysis. Polym Eng Sci 42:539-551
4. Lin CR, Chen RH, Chen CH (2003) Preventing non-uniform shrinkage in open-die hot embossing of PMMA microstructures. J Mater Process Technol 140:173-178
5. Worgull M, Heckele M, Hétu JF et al (2006) Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication. J Microlithogr Microfabr Microsyst 5:011005
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8. Yao DG, Vinayshankar LV, Byung K (2005) Study on squeezing flow during nonisothermal embossing of polymer microstructure. Polym Eng Sci 45:652-660